Technical details |
---|
Sustainability certificates | RoHS |
Features |
---|
Memory bandwidth (max) | 12.8 GB/s |
Memory clock speed | 1600 MHz |
Memory form factor | 240-pin DIMM |
CAS latency | 11 |
Internal memory | 4 GB |
Memory channels | Dual-channel |
ECC | N |
Memory layout (modules x size) | 1 x 4 GB |
Internal memory type | DDR3 |
Component for | PC/Server |
Memory voltage | 1.35 V |
Buffered memory type | Unregistered (unbuffered) |
JEDEC standard | Y |
Operational conditions |
---|
Storage temperature (T-T) | -55 - 100 °C |
Operating temperature (T-T) | 0 - 85 °C |
Weight & dimensions |
---|
Width | 133 mm |
Height | 30 mm |
Weight | 19 g |
Packaging data |
---|
Package weight | 37 g |
Package width | 168 mm |
Package height | 88 mm |
Other features |
---|
Country of origin | China |
Chips organisation | x8 FBGA DRAM |